Form：Toshiba 2017/6/15Browse：5808

Toshiba Semiconductor and Storage Products announced two new "TC3567CFSG" and "TC3567DFSG" leading industry [1] to achieve lower current consumption than the plateau [2] and enhance the safety communication function. These two ICs are Toshiba's latest members of Bluetooth-enabled low power (LE) [3] ver.4.2 communication chips. The sample is available.

Form：CSOT 2017/6/14Browse：4961

On the morning of June 13, the total investment of 35 billion yuan Wuhan Huaxing photoelectric 6th generation flexible LTPS-AMOLED production line (Huaxing photoelectric t4 project), in the optical Valley intelligent manufacturing industry park started.